Thermal Management Products

 
Advanced Converting provides fabricated solutions for our customers’ thermal management requirements enabling cooler and more reliable performance from their products. 

Electronic devices, electrical applications and even LED lighting require efficient heat transfer from the heat source to a cooling device (heat sink). 

Advanced Converting not only aids our customers in material selection for thermal management applications, but will also help them design a component that can be easily integrated into their assembly process. Thermal management components provided by Advanced Converting can be expected to perform up to, or beyond a customer’s requirements, while simplifying assembly methods, and helping to reduce cost. Advanced Converting thermal management products enhance the performance of our customers’ products by minimizing reliability concerns caused by excessive heat, thus improving their products’ operational lifetimes.  Contact Advanced Converting today to review your thermal management application. Some of the thermal management solutions that we provide include:

  • Heat spreaders
  • Gap pads and gap fillers
  • Heat sink bonding
  • Bonding cooling devices to IC packages
  • Power transistor attachment
  • Thermal insulation pads
  • Thermally conductive tapes and adhesives
  • Phase change materials
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