- Heat spreaders - Low cost economical solutions can be found using a heat spreader that attaches to the heat source and has extensions (built in heat sinks) that allow surrounding air to pass over and cool your component.
- Gap pads and gap fillers - Effective transfer of heat from heat source to heat sink is accomplished with properly matched pads and fillers. Input temps and gap fill requirements allow us to select the proper product to meet your cooling needs.
- Heat sink bonding – Some heat sinks cannot be mechanically attached – for these applications, having the thermal conductive pad also bond the heat sink to heat source is ideal. We will match the best product and can fabricate it to sink area needed.
- Bonding cooling devices to IC package
- Power transistor attachment
- Thermal insulation pads – To prevent heat from transferring to other substrates, thermal insulation fiberglass and/or silicone as well as open cell fom/felt materials can be fabricated with high temperature adhesives to provide a level of insulation that you require.
- Thermally conductive tapes and adhesives - thin bond line or thick gap fill – we will match the appropriate adhesive and convert it to a useable size.
- Phase change materials
